Samsung has made a significant innovation in the technology world. The company announced that it has produced the world’s thinnest 12nm-class chip with its newly developed LPDDR5X DRAM chip. Despite being only 0.65mm thick and comparable in thickness to vinyl stickers, it is available in 12GB and 16GB capacity options.
A detailed look at the structure of the chip shows that it consists of four layers, each containing two chips. This structural feature allows the chip to have greater data processing capacity and faster transmission speeds. Additionally, Samsung has made significant improvements to the printed circuit board, epoxy molding compound, and back-end process to make the chip thinner.
Another important feature of the new LPDDR5X DRAM chip is its heat management. The chip’s thin structure distributes heat more effectively, offering a 21.2% higher heat resistance. This makes the chip especially ideal for applications and in-device AI solutions that require high performance.
YongCheol Bae, Vice President of Samsung’s Memory Product Planning Team, stated in his announcement that the LPDDR5X DRAM not only delivers superior performance but also sets a new standard with advanced thermal management. Bae noted that Samsung continuously innovates in close collaboration with its customers, providing solutions that meet future needs for the low-power DRAM market.
This technological advancement not only allows for thinner designs in smartphones and other electronic devices but also offers the potential to include more features in the same size. Samsung’s new DRAM chip could open doors to more innovations and developments within the industry.